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Rotary Sputtering Targets from ALB Materials Inc

Tantalum 03/30/2020

Rotary sputtering target technology has been widely used in thin film deposition, especially for large area coating, such as architectural glass and flat panel displays coating manufacturing. The standard manufacturing methods are plasma spraying onto the base tubes, casting and extrusion of the complete assembly.
 
 
 
Rotary Sputtering Targets from ALB Materials Inc
 
Pure Metal Rotary Sputtering Targets: V, Fe, Co, Ag, Mo, Nb, Ta, W, Ni, Ti, Al, Cr, Cu, Si, Zr, Zn
 
Alloy Rotary Sputtering Targets: NiV, NiCr, FeCo, CuGa, CuIn, CuInGa, ZnSn, CuNi, TiAl, CrAl
 
Other: Si, SiAl, TiSi, ITO, IGZO
 
 
 
Rotary Sputtering Targets Size: 
 
Length<=2000mm, thickness<=15mm
 
 
 
Advantages of Rotary Sputtering Targets
Comparing with planar targets, the rotary sputter target contains more material and offers a greater utilization, which means longer production runs and reduced downtime of the system, increases the throughput of the coating equipment. Besides, rotatable targets allow the use of higher power densities due to the heat build-up being spread evenly over the surface area of the target. As a consequence, an increased deposition speed can be seen along with improved performance during reactive sputtering. 
 
 
 
Manufacturing Methods of Rotary Sputtering Targets from ALB Materials Inc
ALB Materials Inc provides the custom-made cylindrical rotary sputtering targets mainly by thermal spayed, HIP(Hot isostatic pressing) or hot pressing.
 

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