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Sputtering Targets Introduction

Tantalum 02/19/2018

Sputtering Process
Sputtering & Sputtering Targets:

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles (Ar+). The used solid target material is called as Sputtering Target.
By control sputtering process parameters, experts can control the growth and microstructure of the film. The growed thin film can be used as silicide contacts, conductors, diffusion barriers, anti-reflection coatings, transparent conducting oxides, reflective layer, semi-reflective layer, dielectric layer, recording media, absorber layer etc. It’s widely used in semiconductor, display, data storage and photovoltaic industries.

About sputtering gas:
The sputtering gas is often an inert gas such as argon. For efficient momentum transfer, the atomic weight of the sputtering gas should be close to the atomic weight of the target, so for sputtering light elements neon is preferable, while for heavy elements krypton or xenon are used. Reactive gases can also be used to sputter compounds. The compound can be formed on the target surface, in-flight or on the substrate depending on the process parameters.

ALB provides hundreds of metal, alloy and ceramics targets. All our sputtering targets are made of high purity raw material powder with super fine grain size, together with the distinguished homogeneous microstructure to achieve the longer life for target and desired characteristics of sputtering deposited thin film.

With the ability of cold pressing and Plasma spraying process, ALB can also fabricate rotatable targets used for large area coating, which obviously improved the target utilization and reduced the cost for customers.
Materials are available in purities ranging from 99.9% to 99.9999% and are available for all sputtering systems – round, rectangular, S-Gun, Delta, and Ring. Custom designs are also available upon request.
We are committed to 100% customer satisfaction. Our sales engineers want to work with you in selecting the appropriate target material, fabrication process, and bonding assembly that insures the success of your thin film deposition process.

Detailed introduction

A. Processing Methods
1. Vacuum induction melting (VIM)
2. Vacuum arc remelting (VAR)
3. Cold pressing and sintering
4. Powder metallurgical
5. Hot pressing (HP)
6. Hot isostatic pressing (HIP)
7. Plasma spraying
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B. Application Areas
1. Decorate & Hard coating
2. Glass and WEB industry
3. Flat panel display
4. Optical communication/optical industry
5. Optical date store industry
6. Magnetism date store industry
7. Function thin film

C. Material Category
1. Pure metals
2. Alloys
3. Ceramics & Compounds (Oxides, Borides, Carbides, Fluorides, Nitrides, Silicide, Sulfide, Selenide, Telluride)

D. Size & Shape
1. Planar & rectangular
2. Circular
3. Rotatable
4. Cylindrical
5. Ring
6. Magnetrons
7. Cathode
8. Custom-made size and shape

E. Standard Specifications
1. Tolerance on diameters for round targets is +/- 0.010"
2. Tolerance on thickness for all targets is +/- 0.010"
3. Tolerance on flatness for round targets is 0.003" per inch of diameter.
4. Tolerance on flatness for rectangular targets up to 4 x 4" is 0.003" per inch of length.
5. Tolerance on flatness for rectangular targets up to 5 x 15" is 0.015" corner-to-corner, Total Indicator Movement (T.I.R.).
6. Tolerance on flatness for rectangular targets up to 5 x 36" is 0.025" corner-to-corner, T.I.R.

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