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What’s PVD - Physical vapor deposition?

Tantalum 04/11/2016

PVD - Physical vapor deposition, also called as PVD coating, is a process which can be used to produce thin films.

PVD uses physical process (such as heating or sputtering) to produce a vapor of material, which is then deposited on the object which requires coating.
PVD processes include Arc evaporation, Sputtering, Ion plating, and Enhanced sputtering. The most common PVD coating processes are evaporation (typically using cathodic arc or electron beam sources), and sputtering (using magnetic enhanced sources or "magnetrons", cylindrical or hollow cathode sources).

The thin film materials used in PVD are called Evaportation Materials and Sputtering Targets.

ALB’s Sputtering Targets include:
1. Ceramics Sputtering Targets:
CeB6, LaB6, NdB6, AlN, BN, Si3N4, TaN, TiN, B4C, SiC, TiC, WC, VC, ZrC, CdS, CZTS, FeS, MoS2, WS2, AZO, Al2O3, Sb2O3, ATO, BaCeO3, BaO, BeO, Bi2O3, CaNiO3, Cr2O3, CrSiO, CoO, CuAlO2, CuO, GZO, HfO2, IGZO, InFe2O4, In2O3, ITO, IZO, IrO2, Fe3O4, Fe2O3, La2CuO4, LaNiO3, LaNbO3, PbO, LiCoO2, MgO, MnO, Mn2O3, MoO, MoO3, NdNiO3, NiO, Nb2O5, PCMO, RuO2, SiO2, SiO, SrNiO3, Ta2O5, SnO2, Ti3O5, TiO2, TiO, WO3, V2O5, ZnO, ZrO2

2. Rare Earth Materials Sputtering Targets:
Sc, Sc2O3, Y, Y2O3, Ce, CeO2, Dy, Dy2O3, Er, Er2O3, Eu, Eu2O3, Gd, Gd2O3, Ho, Ho2O3, La, La2O3, Lu, Lu2O3, Nd, Nd2O3, Pr, Pr6O11, Sm, Sm2O3, Tb, Tb4O7, Tm, Tm2O3, Yb, Yb2O3

3. Semiconductor Sputtering Targets:
Ag2S, Ag2Se, Ag2Te, Al2S3, Al2Se3, Al2Te3, AlSb, As, As2S3, As2Se3, Bi2O3, Bi2S3, Bi2Se3, Bi2Te3, Cd, Cd2SnO4, Cd3As2, CdS, CdSb, CdSe, CdTe, Cu2S, Cu2Se, Cu2Te, Ga, Ga2O3, Ga2Se3, GaAs, GaCl3, GaF3, GaI3, GaS, GaSb, GaSe, GaTe, GeS, GeS2, GeSe, GeTe, HgS, HgTe, In, In2O3, In2S3, In2Se3, InAs, InBi, InBr, InBr3, InCl, InCl3, InF3, InI, InI3, InSb, InSe, InTe, ITO, MnSe, MnTe, MnTe2, MoSe2, Na2TeO3, NbAs, NiS2, NiSe, PbO, PbS, PbSe, PbTe, S, Sb, Sb2O3, Sb2O5, Sb2S3, Sb2Se3, Sb2Te3, SbI3, Se, SeS2, Si, SnO2, SnS, SnS2, SnSe, SnTe, Te, TeO2, WSe2, Zn, Zn3P2, ZnAs2, ZnO, ZnS, ZnSb, ZnSe, ZnTe

4. Metal and Alloy Sputtering Targets:

ALB’s Evaporation Materials include:
Al, Sb, Bi, B, Cd, Ce, Cr, Co, Cu, Dy, Er, Eu, Gd, Ge, Au, Hf, Ho, In, Ir, Fe, La, Pb, Lu, Mg, Mn, Mo, Nd, Ni, Nb, Pd, Pt, Pr, Re, Ru, Sm, Sc, Se, Si, Ag, Ta, Te, Tb, Tm, Sn, Ti, W, V, Yb, Y, Zn, Zr, Al2O3, Sb2O3, Bi2O3, CeO2, Cr2O3, CuO, Gd2O3, HfO2, In2O3, Fe2O3, MgO, Nd2O3, NiO, Nb2O5, Pr(TiO3)2, Pr6O11, Sm2O3, Sc2O3, SiO2, SiO, Ta2O5, TiO2, TiO, Ti3O5, Ti2O3, WO3, V2O5, ZnO, ZrO2, BaF2, CaF2, CeF3, DyF3, ErF3, LaF3, MgF2, NdF3, KF, SmF3, NaF, SrF3, YbF3, YF3, BaTiO3, CuS, Na3AiF6, HfC, LaTiO3, PrTiO3, SiC, Si3N4, SrTiO3, TiN, ZnSe, ZnS, AlN, BN, CdS, La2O3, LiF, SnO2, Y2O3

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