Sputtering is a technique used to deposit thin films of a material onto a surface.
Sputtering is a process whereby particles are ejected from a solid target material(sputtering targets) due to bombardment of the target by energetic particles. It only happens when the kinetic energy of the incoming particles is much higher than conventional thermal energies (≫ 1 eV).
What is Magnetron Sputtering?
Because ions are charged particles, magnetic fields can be used to control their velocity and behavior.
Magnetron sputtering uses magnets behind the negative cathode to trap electrons over the negatively charged target material so they are not free to bombard the substrate, allowing for faster deposition rates.
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