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Target Bonding

We provide Indium bonding service and elastomer bonding service.

Indium bonding:

Indium bonding is the preferred method for sputtering targets due to the best thermal conductivity of all available bonds and is the most efficient at drawing heat away from the target.

Indium is also more malleable than other bonding solders, which allows some "give" when the target expands at a different rate than the backing plate. This reduces cracking that is caused by mismatch in the thermal expansion coefficients of the target and backing plate.

The main limitation of the indium bonding is the melting temperature of the indium solder. Indium has a melting point of 156.6°C so temperatures in excess of 150°C will cause the bond to melt and fail. Most materials can be indium bonded.

Elastomer bonding:

Elastomer bonding is an alternative method that touts a higher temperature capability over the indium bonding. Elastomer bonding is recommended when customers are consistently melting indium bonding.

Major Features of Elastomer bonding:

Elastomer bonds are electrically conductive.

Elastomer Bond material can be handled and dispensed with great precision and has been proven capable of creating a reliable joint between most any combinations of materials.

Elastomer Bond results in a stress free assembly in application and can handle bonding large surface areas of dissimilar materials.

Elastomer Bond is well suited for bonding of fragile materials and can be managed in an environmentally friendly way.

We recommend elastomer bonding for low melting point target materials, as well as, temperature sensitive compounds and targets that have either low density or are especially fragile.

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